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SDLS008 



SN54LSB82. SN54LS684, SN54LSB85. SN54LS687, SN54LSG88, 

SN74LS682, SI\I74LS684 THRU SN74LS688 
8 BIT MAGNITUDEIIDENTITY COMPARATORS 



D2617. JANUARY 1981 -REVISED MARCH 1986 



Compares Two-8-Bit Words 

Choice of Totem-Pole or Open-Collector 
Outputs 

Hysteresis at P and Q Inputs 

'LS682 has 20-kn Pullup Resistors on the Q 
Inputs 



SNS4LS682, SN54LS684, SN54LS685 ... J PACKAGE 
SIM74LS6S2, S1M74LS684. SN74LS685 . , . DW OR N PACKAQE 
(TOP VIEW! 



SN74LS686 and 'LS687 . 
24-Pin, 300-Mil Packages 



JT and NT 



TYPE 






OUTPUT 
ENABLE 


OUTPUT 
CONFIGURATION 


20-k(l 
PULLUP 


P - Q 


P > Q 


■LS682 


yes 


yes 


no 


toiem-pole 


yea 


■LS6e4 


ves 


ves 


no 


totem-polB 


no 


'LS6S5 


yCE 


yes 


no 


open -collector 


ro 


SN74LS686 


yea 


ves 


yes 


io[em-poie 


no 


■LS687 


yes 


ves 


yes 


open-collecior 


no 


■LS688 


yes 


no 


yes 


tQiem-pole 


no 



P>Q L 


'U 


PQ C 


2 


00 Z 




PI C 


4 


01 C 


S 


P2r 


E 


02: 




P3 C 


e 


03 r 




GND C 


10 



vcc 

P=Q 
□7 
P7 
06 
P6 
05 
PB 
D Q4 

: P4 



SN54LS682, SN54LS684. SN54LSe85 
(TOP VIEW! 



. FK PACKAGE 



S si 



(J II 
> lo- 



SN54LS6a7 . . . JT PACKAGE 
SN74LS686. SN74LS687 ... DW OR NT PACKAGE 
(TOP VIEW) 




PI ] 4 
01 ] 6 

3a 



02 
P3 



3 2 1 2D 19 



is: 
I'C 
16[ 
15[ 



9 10 1117 13 
r-i i-i i-i r-ir-i 



Q7 
P7 
Q6 
P6 
Q5 



8 i 



SN54LS688 ... J PACKAGE 
SN74LS6B8 . . . OW OR N PACKAGE 
(TOP VIEW) 



SN54L3687 . . . FK PACKAGE 
(TOP VIEW) 



00 'ii 

PI ]6 

Ql ] ' 

NC ]s 

MC ]9 

P2 D'O 

02 ] " 



LJ LJl—l LJ UILJ l_l 
4 3 2 I 5B ^7 ,>G 



121314'5 IE. 1713 
r-l ^ r-i ^ m l-i 



poc 
oo[; 
PIC 

QIC 
P2C 
Q2C 
P3C 

gndC 



9 



□ P = 



25 [ 


Q7 


24 C 


P7 


23 [ 


NC 




NC 


3'L 


06 


20 [ 


P6 


19[ 


□5 



SN54LS6B3 . . . FK PACKAGE 
(TOP VIEW) 



OICJ 

So u! II 

ff lO > iCi_ 



n <2 D ^ ^ 

D- a s 2 a. o c- 
NC — No interna! connection 



PI ]a 

01 ]B 
P2 ]6 

02 ] 7 
P3 ]a 



LJ l_l LJ LJ LJ 
3 2 1 20 19 



1B[ 



9 10 1! 12 13 
i-ii-i i-i r-i 

a D ? a if 



ia[ Q7 

17 [ P7 

ie[ Q6 



P6 



4[ Q5 



fKUUUUiluril UAIA dacumenls contain mlDrmation ■ , 

current as cf publication date. Products cDnfarm to -f^ ^Cli 

spccilicalians per the terms pf Texas Instruments I EXAS ^* 

standard warranty. Prnduction processing does not Ivrc:^Tni T il !inr* X i -Txr^ 

necessarily induce testing ot all pararaatErs. IN 3 1 rv.UIVlt.rN I O 



i'05T OfFiCE BOK 655012 • DAllAS. TEXA5 7520^ 



SIU54LS682, Sni54LS684, SN54LS685, SN54LS687, SN54LSe88 
SN74LS68Z, SN74LS684 THRU SN74LS688 
8-BIT MAGNITUDE/IDENTITY COMPARATORS 



description 



FUNCTION TABLE 



These magnitude comparators perform comparisons oi 
two eight-bit binary or BCD wotds. All types provide 
P = Q outputs and ail except 'LS68a provide 
P > Q outputs as well. The 'LS682, 'LS6e4, "LSeee, and 
'LS68e have totem-pole outputs, while the 'LS685 and 
'LS687 have open-collector outputs. The 'LS682 features 
20-k[! pullup termination resistors on the Q inputs for 
analog or switch data, 



logic symbols'!^ 



'LS6a2. 'LS684 



PO ■ 
PI ■ 
P2- 
P3. 
P4 . 
PS . 
PB - 
P7 ■ 

QO- 
Ql- 
QZ- 
Q3- 
Q4- 
05- 
QB- 
Q7- 



!2) 




COIVIP 

t> 


(4) 




(6) 






tat 






(11) 




>p 


(13) 






(T5I 




P=Q 


(17) 










|3> 
15) 






17) 






(91 




(12) 






1141 






(161 






(181 


7, 









(19) 



■fi>a 



PQ- 
P1 ■ 
P2- 
P3 - 
P4. 
P5 - 
P6 ■ 
P7 ■ 

QO- 
Ql- 

ai- 

Q3- 
Q4- 
Q5- 
06- 
07- 



INPUTS 


OUTPUTS 


DATA 


ENABLES 






P. a 


S.ST 


G2 


P = Q 


L 


X 


L 


H 


P>Q 


X 


I 


H 


L 


P<Q 


X 


X 


H 


H 


P = Q 


H 


X 


H 


H 


P>Q 


X 


H 


H 


H 


X 


H 


H 


H 


H 



NOTES; 1 



'LS685 



The last three lines of the function table applies only 
to the devices having enable inputs, i.e., 'LS686 
thru 'Lseas. 

The P< Q function can he generated by applying 
the P = Q and P>Q outputs to a 2-input lyAND 

gate. _ 

For 'LSeae and 'LSeS?, G 1 enables P = Q and 52 
enables P>6. 



(2) 




CO(VlP 


141 




161 






(8) 






(111 




>P 


(13) 






(15) 




P-OQ 


IT7) 


117/ 








(3( 


HO', 




(S) 




(7) 




p>qQ 


(91 




(12) 




<Q 


(14) 






(1BI 






(131 


7. 









Gl- 
G2- 
PO- 
P1- 
P2- 
P3- 
P4- 
P5- 
P6- 
P7- 

QO- 
Q1- 
Q2- 
Q3- 
04- 
05- 
QB- 
07- 



(2) 




G1 

G2 
D 0' 


COIWP 


123) 






(3) 




151 




18) 






110) 






(13) 




1 p 


nsi 




1P=Q 


(17) 




(20) 


7, 










14) 




rro 




(E) 




(9) . 




ZP-Q 


(11) 




(14) 






(16) 

— 








(IB) 








(ZD 


m. 









-P=Q 



(1) 



^These symbols are in accordance with ANSI/IEEE Std 91-1984 and lEC Publication 617-12. 
Pin numbers shown are for DW, J, JT, N, and NT packages. 



Texas ^ 
Instruments 

PO'^T CFfltt BOX eSbOi: - D.'.LLHS. TEXAS JSJS!, 



SN54LS682, SI\I54LS684, SN54LS685, SI\t54LS687, SN54LS68B, 
SN74LSE82, SN74LS684 THRU SN74LS688 
8-BIT MAGhllTUDEIlDENTITY COMPARATORS 



logic symbols^ (continued) 

'LS687 




-LS688 




^These symbols are in accordance with ANSI/IEEE Std 91-1984 and lEC Publicsiion 617-12. 
Pin numbeis shown are for DW, J, JT, N. and MT packages, 

schematics of inputs and outputs 



EQUIVALENT OF EACH Q INPUT 
OF ■LS682 ONLY 

VCC 



INPUT — 1' 




EQUIVALENT OF ALL 
OTHER INPUTS 
Vcc f 



12 ka NOM 



INPUT -i i i 



TYPICAL OF OUTPUTS OF 
LS682, 'LS684. 'LS686,'LS68B 
m Vcc 



100 t! NOM 




OUTPUT 



TYPICAL OF OUTPUTS OF 
'LS68B. 'LS687 



OUTPUT 




Texas 
Instruments 

PnST r,FHCE BOX 655012 • DALLAS. TEXAS 75265 



SN54LS682, SI\I54LS684, SN54LS68B 
SN74LS68Z, SN74LS684, SN74LS685 
8-BIT MAGMITUDE/IDENTiTY COMPARATORS 



'LS682, 'LS684. 1.3685 logic diagram (positive logic) 



P0-%>O-i 




Pin numbers Ehown are for DW, J, and N packages. 



Texas ^ 
Instruments 

POST office aOK 66651! ■ OALLHS. TEXAS 75566 



SN54LS687 
SN74LS68B, SI\I74LSB87 
8 BIT MftGNITUDE/lOENTITY COMPARATORS 



'LS686, 'LS687 logic diagram (positive logic] 



Q7'll!j^x>-r 




Pin numbers shown are for DW, JT, and NT packages. 



Texas 
Instruments 

POST OFflct BOK - D/iLLAS. TEXaS 



SN54LSGB2, SN54LS684, Sni54LS6B5, SN54LS687, Sni54LS688 
SN74LS682, SN74LS684 THRU Siy74LS688 
8 BIT IDENTITY COMPARATORS 



'LS688 logic diagram (po&itiva logic) 




Pin numbers shown are for DW, J, and N packages. 

absolute maximum ratings over operating free-air temperature range (unless otherwise noted) 



Supply voltage, Vcc (see Note 1) 7V 

Input voltage: Q inputs of 'LS682 5.5 V 

Ail other inputs 7 V 

Off-state output voltage: '15685, 'LS687 7 V 

Operating free-air temperature range: 

SN54LS682, SN54LS684, SN54LS685, SN54LS687, SN54LS688 -55°C to 125°C 

SiM74LS682, SNI74LS684 thru SN74LS6aa 0°C to 70°C 

Storage temperature range -65°Cto150°C 



NOTE 1: Voltage values are with respect to network ground terminal. 



Texas 
Instruments 



SN54LSG82, SN54LS684, SN54LSG88 
SN74LS682. SN74LS684, SN74LS686, SN74LS688 
8 BIT WIAGNITUDEIIDENTITY COMPARATORS WITH TOTEM POLE OUTPUTS 



recommended operating conditions 





SNBALS' 


SN74LS' 


UNIT 


MIN NOM MAX 


MIN NOM TVIAX 


Supply voltage, Vqq 


4.5 5 5.5 


4.85 5 5.25 


V 


High-level output current, Iqh 


-400 


-400 


^A 


Low-level output current, Iql 


12 


24 


mA 


Operating free-air temperature. 


-55 125 


70 


"C 


electrical characteristics over recommended operating free-air temperature range (unless otherwise 
noted) 


PARAMETER 


TEST CONDITtONST 




SN74LS' 


UNIT 


MIM TVP^ MAl^ 
1V1IIV 1 1 r IVIMyv 


MIN TYP* MAX 


Vjn High-level input voltage 




2 


2 


V 


V|L Low-levei input voltage 




0.7 


0.8 


V 


Vj+ -V-f- Hysteresis j P or Q inputs 




0.4 


0.4 


V 


ViK Input clamp voltage 


Vcc = MIN, 1| = - 18 mA 


-1,5 


-1.5 


V 


VOH High-level output voltage 


Vcc = MIN, V|H = 2 V, 
ViL = ViLmax, Iqh = -400 ;iA 


2.5 


2.7 


V 


Vol Low-level output voltage 


Vcc = l^'f^' 
V,H = 2 V, 
ViL ~ V|Lmax 


lOL = 12 mA 


0.25 0.4 


0.25 0.4 


V 


lOL = 24 mA 




0.35 0.5 


input current 
Ij at maximum 
input voltage 


Q inputs, 'LS6a2 


Vcc = MAX, V| = 5.5 V 


0.1 


0.1 


rtiA 


All other inputs 


Vcc = I^A^. Vi = 7 V 


l|H High-level input current 


Vcc = '^l = 2.7 V 


20 


20 




Lowiz-level 

'IL 

input current 


Q inputs, 'LSB82 


Vcc = MAX, V[ = 0.4 V 


-0.4 


-0.4 


mA 


Ail other inputs 


-0.2 


-0.2 


'OS^ Short-circuit output current 


Vcc = I^A^- Vo = 


-20 -1O0 


- 20 - 1 00 


mA 


Ice Supply current 


■LS6a2 


Vcc = '^^A^'. See Note 1 


42 7Q 


42 70 


mA 


'LS634 


40 65 


40 65 


'LS6e6 


44 75 


44 75 


'LS638 


40 65 


40 es 



'For conditions shown as MIN or MAX. use the appropriate values specified under recommended operating conditions. 
* All typical values are at Vcc = 5 V, T^ = 25 "C. 

S Not more than one output should be shorted at a time, and duration of the short-circuit should not exceed one second. 
NOTE 1 : Ice measured with any G inputs grounded, all other inputs at 4.5 V, and all outputs open, 



Texas 
Instruments 

^0S~ OFFICE eox 655012 • DALLAS TEXAS T52G5 



Sni54LS682, SN54LS684, SN54LS688 

SN74LS682, SN74LS684. SN74LSG86, SN74LS688 

8-BIT MAGNITUDEIIDENTITY COMPARATORS WITH TOTElUt-POLE OUTPUTS 



switching characteristics, VcC = 5 V, Ta = 25*0 



parametert 


FROM 


TO 


TEST 


'LS682 


'LS684 


'LS686 


'LS688 


UNIT 


1 1 r u ia\ 


lOU T rU T 1 


UUIMUITIUnb 


MIN TYP 


MAX 


MlIM TYP 


MAX 


MIN TYP 


MAX 


KHim Tuo nil ti V 
lYlIlM 1 Yr IviAa 


*PLH 


p 


p^ 




13 


25 


15 


25 


13 


25 


12 18 


n& 


tPHL 




IS 


25 


17 


25 


20 


30 


17 23 


tpLH 


Q 






14 


25 


16 


25 


13 


25 


12 18 


ns 


tPHU 




Al = 667 0, 
Cl = IS pF=, 
All other 
inputs low, 
Sea Note 2 


IS 


25 


15 


25 


21 


30 


17 23 


«PLH 


G, G1 








11 


20 


12 IB 


ns 


tpHL 






19 


30 


13 20 


tPLH 


P 


p>^ 


20 


30 


22 


30 


19 


30 




ns 


^PHU 


15 


30 


17 


30 


15 


30 




IPLH 


Q 


P>Q 


21 


30 


24 


30 


18 


30 




n$ 


tpHL 




19 


30 


20 


30 


19 


30 




tpLH 


G2 










21 


30 




ns 


tPHI 








IB 


25 





*PLH propagation delay time, tow-to-highi-lawel outputs; tpHL = propagation delay time, high-to-iovu-level output. 
NOTE 2: Load circuits and voltage waveforms are shown in Section 1. 



Texas ^ 
Instruments 

POST OFFICE eOX • DALLAS. TEXAS 7^3G!> 



SN54LS885, SN54LS6a7 
SN74LS6B5. SN74LS687, SN74LS688 
8-BlT MAGNITUDE/IDENTITY COMPARATORS WITH TOTEM-POIE OUTPUTS 



recommended operating conditions 





SN54LS' 


SN74LS" 


UNIT 


MIN NOM MAX 


MIN NOM MAX 


Supplv voltage, Vqc 


4.E 5 B.5 


4.85 5 5.25 


V 


High-level output current, Vq|^ 


5.5 


5.5 


V 


Low-level output current, Iql 


12 


24 


mA 


Operating freq-air temperature, T;^ 


-55 125 


70 





eiectricai characteristics over recommended operating free-air temperature range (unless otherwise 
noted) 



PARAMETER 


TEST CONDITIONS^ 


SN54LS' 


SN74LS' 


UNIT 


MIN TYP MAX 


MIN TYP MAX 


V|H High-level input voltage 




2 


2 


V 


V|L Low-lBuel input uoltage 




0-7 


0-8 


V 


Vj + - Vj- Hysteresis j P or Q Inputs 


Vcc = M'N 


0.4 


0.4 


V 


V|K Input clamp voltage 


Vcc l^'l^. 'l 18 mA 


-1.5 


- 1.5 


V 


IqH High-level output voltage 


Vcc = l^'f^' V|H = 2 V, 
V|L = V[imax, Vqh = 5.5 V 


250 


100 




Vql Low-level output voltage 


Vcc = f^^f^- 
V|H = 2 V, 
V|L = Vinnast 


'OL " ^ 2 mA 


0,25 0,4 


0.25 0.4 


V 


Iql = 24 mA 




0,35 0.5 




Vcc = MAX, V| = 7 V 


0.1 


0.1 


(inA 


l|H High-level input current 


Vcc = MAX, V| - 2.7 V 


20 


20 




l|L Low-level input current 


Vcc = I^AX, Vi = 0.4 V 


-0.2 


-0.2 


mA 


Supply 

Ice 

current 


■LS685 


Vcc = I^A'^' See Note 1 


40 65 


40 65 


mA 


'Lsee? 


44 75 


44 75 



'For conditions shovi/n as MIM or MAX, use the appropriate values specified under recommended operating conditions. 
*AII tvpical values are at Vcc = 5 V, Ta - 25 "C, 

NOTE 1 : Icc 's measure w/ith any 5 inputs grounded, all other inputs at 4.5 V, and all outputs open. 



Texas ^ 
Instruments 

POST OFFICE ?,0X 6^^012 " DALLAS- TEVA^ 75765 



SI\154LS685, SN54LS687 
SN74LS685, SN74LS687 

8-BIT MAGNlTUDEjlDEMTITY COMPARATORS WITH OPEN^COLLECTOR OUTPUTS 



switching characteristics, Vcc = 5 V, Ta = 25 °C 



PARAMETER 


FROM 


TO 


TEST CONDITIONS 


'Lsess 


•LS687 


UNIT 


UN PI IT1 




M1N TVP 


MAX 


MIN TYP 


MAX 


^PLH 


p 






30 


4S 


24 


OL> 


ns 


rn L 




19 


35 


20 


30 


tPLH 


Q 


p^ 




24 


45 


24 


35 


ns 


tPHL 


RL = 667 0, 
Ci = 45 pF, 

All other 
inputs low. 
See Note 2 


23 


35 


20 


30 


tPLH 








21 


35 


ns 


tPHL 




IS 


30 


tPLH 


P 


P>Q 


32 


45 


24 


35 


ns 


'PHL 


16 


35 


16 


30 


^PLH 


Q 


p>n 


30 


45 


24 


35 


ns 


tPHL 




20 


35 


16 


30 


tPLH 


G2 


P>Q 






24 


35 


ns 


tPHL 






15 


30 



tPLH propagation delay time, low-to-high-level outputs: tp^L " propagation delay time, high-to-low-level output. 
NOTE 2: Load circuits and voltage waveforms are shown in Section 1. 



Texas ^ 
Instruments 

i'OST cFFiCE acx e5tai2 • DULLAS, TEXAS 75266 



^ ^^^^ PACKAGE OPTION ADDENDUM 

Instruments 

www.ti.com 4-Jun-2007 



PACKAGING INFORMATION 



Orderable Device 


Status 


Pacl<age 
Type 


Package 
Drawing 


Pins Package Eco Plan 
Qty 


Lead/Ball Finisli 


IV1SL Peak Temp 


841 51 01 2A 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


841 51 01 2A 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


841 51 01 RA 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


841 51 01 RA 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


841 51 01 SA 


ACTIVE 


CFP 


W 


20 




TBD 


A42 


N / A for Pkg Type 


841 51 01 SA 


ACTIVE 


CFP 


W 


20 




TBD 


A42 


N / A for Pkg Type 


841 5201 2A 


ACTIVE 


LCCC 


FK 


20 


1 


TBD 


POST- PLATE 


N / A for Pkg Type 


841 5201 RA 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


841 5201 SA 


ACTIVE 


CFP 


W 


20 


1 


TBD 


A42 


N / A for Pkg Type 


841 5301 2A 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


841 5301 RA 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


841 5301 SA 


ACTIVE 


CFP 


W 


20 




TBD 


A42 


N / A for Pkg Type 


SN54LS682J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SN54LS682J 


ACTIVE 


CDIP 


J 


20 


1 


TBD 


A42 SNPB 


N / A for Pkg Type 


SN54LS684J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SN54LS688J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SN74LS682DW 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DW 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWE4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWE4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWG4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWG4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWR 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWR 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWRE4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWRE4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWRG4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWRG4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682N 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS682N 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS682NE4 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS682NE4 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 


CU NIPDAU 


N / A for Pkg Type 



Addendum-Page 1 



^ ^^^^ PACKAGE OPTION ADDENDUM 

Instruments 

www.ti.com 4-Jun-2007 



Orderable Device 


Status 


Pacltage 
Type 


Package 
Drawing 


Pins Package Eco Plan 
Qty 


Lead/Ball Finisli 


IVISL Peak Temp 


(RoHS) 


SN74LS682NSR 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSR 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSRE4 


ACTIVE 


so 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSRE4 


ACTIVE 


so 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSRG4 


ACTIVE 


so 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSRG4 


ACTIVE 


so 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DW 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWE4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWG4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWR 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWRE4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWRG4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684N 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS684NE4 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS684NSR 


ACTIVE 


so 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684NSRE4 


ACTIVE 


so 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684NSRG4 


ACTIVE 


so 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS686DW 


OBSOLETE 


SOIC 


DW 


24 




TBD 


Call Tl 


Call Tl 


SN74LS686NT 


OBSOLETE 


PDIP 


NT 


24 




TBD 


Call Tl 


Call Tl 


SN74LS687NT 


OBSOLETE 


PDIP 


NT 


24 




TBD 


Call Tl 


Call Tl 


SN74LS687NT 


OBSOLETE 


PDIP 


NT 


24 




TBD 


Call Tl 


Call Tl 


SN74LS688DW 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688DWE4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688DWG4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688DWR 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688DWRE4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688DWRG4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 



Addendum-Page 2 



Texas 



Instruments 

www.ti.com 



PACKAGE OPTION ADDENDUM 



4-Jun-2007 



Orderable Device 


Status 


Packaae 
Type 


Packaae 
Drawing 


Pins Pacloge Eco Plan 
Qty 


Lead/Ball Finisli 


IVISL Peal< Temp 


SN74LS688N 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS688N3 


OBSOLETE 


PDIP 


N 


20 




TBD 


Call Tl 


Call Tl 


SN74LS688NE4 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS688NSR 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
nn Sh/Rrl 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688NSRE4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688NSRG4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1 -260C-UNLIM 


SNJ54LS682FK 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


SNJ54LS682FK 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


SNJ54LS682J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SNJ54LS682J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SNJ54LS682W 


ACTIVE 


CFP 


W 


20 




TBD 


A42 


N / A for Pkg Type 


SNJ54LS682W 


ACTIVE 


CFP 


W 


20 




TBD 


A42 


N / A for Pkg Type 


SNJ54LS684FK 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


SNJ54LS684J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SNJ54LS684W 


ACTIVE 


CFP 


W 


20 




TBD 


A42 


N / A for Pkg Type 


SNJ54LS688FK 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


SNJ54LS688J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SNJ54LS688W 


ACTIVE 


CFP 


W 


20 




TBD 


A42 


N / A for Pkg Type 



The marketing status values are defined as follows: 
ACTIVE: Product device recommended for new designs. 

LIFEBUY: Tl has announced that the device will be discontinued, and a lifetime-buy period is in effect. 

NRND: Not recommended for new designs. Device is in production to support existing customers, but Tl does not recommend using this part in 
a new design. 

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. 
OBSOLETE: Tl has discontinued the production of the device. 

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check 
http://www.ti.com/productcontent for the latest availability information and additional product content details. 
TBD: The Pb-Free/Green conversion plan has not been defined. 

Pb-Free (RoHS): Tl's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements 
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered 
at high temperatures, Tl Pb-Free products are suitable for use in specified lead-free processes. 

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and 
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS 
compatible) as defined above. 

Green (RoHS & no Sb/Br): Tl defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame 
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) 



MSL, Peak Temp, 
temperature. 



The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder 



Important Information and Disclaimer:The information provided on this page represents Tl's knowledge and belief as of the date that it is 
provided. Tl bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the 
accuracy of such information. Efforts are underway to better integrate information from third parties. Tl has taken and continues to take 
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on 
incoming materials and chemicals. Tl and Tl suppliers consider certain information to be proprietary, and thus CAS numbers and other limited 
information may not be available for release. 



Addendum-Page 3 



^ ^^^^ PACKAGE OPTION ADDENDUM 

Instruments 

www.ti.com 4-Jun-2007 



In no event shall Tl's liability arising out of such information exceed the total purchase price of the Tl part(s) at issue in this document sold by Tl 
to Customer on an annual basis. 



Addendum-Page 4 



Texas 



Instruments 

www.ti.com 



PACKAGE MATERIALS INFORMATION 



19-May-2007 





■ P ■ 




■ I 




> < 




^ 4^ 4 ^ 


+ 4 ^ 4^ 4 < 


> 4" 4 ^ "4 4 ^/ 


rr 3-1 

1 ^ 1 




-< 


i- 






i- 






















\ \ 




■* — A* — " 


— Cavity 



Carrier tape design is defined largely by the component lentgh, width, and thic[<ness. 





= Dimension designed to accommodate the component 


width. 


Bo 


= Dimension designed to accommodate the component 


length. 


Ko 


= Dimension designed to accommodate the component 


thickness. 


W 


= Ovgraii width of the carrier tape. 




P = 


= Pitch between successive cavity centers. 





oooooooo 



Q1 1 Q2 




Q1 1 Q2 




Q3 1 Q4 




1 Q4 






Sprocket Holes 



Pocket Quadrants 

TAPE AND REEL INFORMATION 



Pack Materials-Page 1 



PACKAGE MATERIALS INFORMATION 

19-May-2007 



Device 


Package 


Pins 


Site 


Reel 

DifiiTiAtAr 
uiai 1 idwi 

(mm) 


Reel 
Width 
(mm) 


AO (mm) 


BO (mm) 


KG (mm) 


PI 

(mm) 


W 
(mm) 


Pini 


SN74LS682DWR 


DW 


20 


MLA 


330 


24 


10.8 


13.0 


2.7 


12 


24 


Q1 


SN74LS682NSR 


NS 


20 


MLA 


330 


24 


8.2 


13.0 


2.5 


12 


24 


Q1 


SN74LS684DWR 


DW 


20 


MLA 


330 


24 


10.8 


13.0 


2.7 


12 


24 


Q1 


SN74LS684NSR 


NS 


20 


MLA 


330 


24 


8.2 


13.0 


2.5 


12 


24 


Q1 


SN74LS688DWR 


DW 


20 


MLA 


330 


24 


10.8 


13.0 


2.7 


12 


24 


Q1 


SN74LS688NSR 


NS 


20 


MLA 


330 


24 


8.2 


13.0 


2.5 


12 


24 


Q1 




TAPE AND REEL BOX INFORMATION 



Device 


Package 


Pins 


Site 


Length (mm) 


Width (mm) 


Height (mm) 


SN74LS682DWR 


DW 


20 


MLA 


333.2 


333.2 


31.75 


SN74LS682NSR 


NS 


20 


MLA 


333.2 


333.2 


31.75 


SN74LS684DWR 


DW 


20 


MLA 


333.2 


333.2 


31.75 


SN74LS684NSR 


NS 


20 


MLA 


333.2 


333.2 


31.75 


SN74LS688DWR 


DW 


20 


MLA 


333.2 


333.2 


31.75 


SN74LS688NSR 


NS 


20 


MLA 


333.2 


333.2 


31.75 



Texas 
Instruments 

www.ti.com 



Pack Materials-Page 2 




Pack Materials-Page 3 



J (R-GDIP-T**) 

14 LEADS SHOWN 



CERAMIC DUAL IN-LINE PACKAGE 



I B 1 



j u u u u u 

0.065 (1,65) 



0.045 (1,14) 



niiiii 
UIM 


14 


16 


18 


20 





0.300 
(7,62) 
BSC 


0.300 
(7,62) 
BSC 


0.300 
(7,62) 
BSC 


0.300 
(7,62) 
BSC 


B MAX 


0.785 
(19,94) 


.840 
(21,34) 


0.960 
(24,38) 


1.060 
(26,92) 


B MIN 










C MAX 


0.300 
(7,62) 


0.300 
(7,62) 


0.310 
(7,87) 


0.300 
(7,62) 


C MIN 


0.245 
(6,22) 


0.245 
(6,22) 


0.220 
(5,59) 


0.245 
(6,22) 



0.005 (0,13) MIN 



I 0.026 (0,66) 
'^0.014 (0,36) 



1 0.100 (2,54) 



0.060 (1,52) 
0.015 (0,38) 



f 

0.200 (5,08) MAX 
^ Seating Plane 



0.130 (3,30) MIN 



0.014 (0,36) 
0.008 (0,20) 




0-1 5* 



4040083/F 03/03 

NOTES: A. All linear dimensions are in inches (millimeters). 

B. This drawing is subject to change without notice. 

C. This package is hermetically sealed with a ceramic lid using glass frit. 

D. Index point is provided on cap for terminal identification only on press ceramic glass frit seal only. 

E. Falls within MIL STD 1835 GDIP1-T14, GDIP1-T16, GDIP1-T18 and GDIP1-T20. 



^ ^^^^ PACKAGE OPTION ADDENDUM 

Instruments 

www.ti.com 18-Sep-2008 



PACKAGING INFORMATION 



Orderable Device 


Status 


Pacl<age 
Type 


Package 
Drawing 


Pins Package Eco Plan 
Qty 


Lead/Ball Finisli 


IV1SL Peak Temp 


841 51 01 2A 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


841 51 01 RA 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


841 51 01 RA 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


841 51 01 SA 


ACTIVE 


CFP 


W 


20 




TBD 


Call Tl 


N / A for Pkg Type 


841 51 01 SA 


ACTIVE 


CFP 


W 


20 




TBD 


Call Tl 


N / A for Pkg Type 


841 5201 2A 


ACTIVE 


LCCC 


FK 


20 


1 


TBD 


POST- PLATE 


N / A for Pkg Type 


841 5201 RA 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


841 5201 SA 


ACTIVE 


CFP 


W 


20 


1 


TBD 


Call Tl 


N / A for Pkg Type 


841 5301 2A 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


841 5301 RA 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


841 5301 SA 


ACTIVE 


CFP 


W 


20 




TBD 


Call Tl 


N / A for Pkg Type 


SN54LS682J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SN54LS682J 


ACTIVE 


CDIP 


J 


20 


1 


TBD 


A42 SNPB 


N / A for Pkg Type 


SN54LS684J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SN54LS688J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SN74LS682DW 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DW 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWE4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWE4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWG4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWG4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWR 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWR 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWRE4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWRE4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWRG4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682DWRG4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682N 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS682N 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS682NE4 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS682NE4 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 



Addendum-Page 1 



^ ^^^^ PACKAGE OPTION ADDENDUM 

Instruments 

www.ti.com 18-Sep-2008 



Orderable Device 


Status 


Pacltage 
TvDe 


Package 
Drawing 


Pins Package Eco Plan 
Qty 


Lead/Ball Finisli 


IVISL Peak Temp 


SN74LS682NSR 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSR 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSRE4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSRE4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSRG4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS682NSRG4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DW 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWE4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWG4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWR 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWRE4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684DWRG4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684N 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS684NE4 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS684NSR 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684NSRE4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS684NSRG4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS686DW 


OBSOLETE 


SOIC 


DW 


24 




TBD 


Call Tl 


Call Tl 


SN74LS686NT 


OBSOLETE 


PDIP 


NT 


24 




TBD 


Call Tl 


Call Tl 


SN74LS687NT 


OBSOLETE 


PDIP 


NT 


24 




TBD 


Call Tl 


Call Tl 


SN74LS687NT 


OBSOLETE 


PDIP 


NT 


24 




TBD 


Call Tl 


Call Tl 


SN74LS688DW 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688DWE4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688DWG4 


ACTIVE 


SOIC 


DW 


20 


25 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1 -260C-UNLIM 


SN74LS688DWR 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688DWRE4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1 -260C-UNLIM 


SN74LS688DWRG4 


ACTIVE 


SOIC 


DW 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1 -260C-UNLIM 


SN74LS688N 


ACTIVE 


PDIP 


N 


20 


20 


Pb-Free 


CU NIPDAU 


N / A for Pkg Type 



Addendum-Page 2 



Texas 



Instruments 

www.ti.com 



PACKAGE OPTION ADDENDUM 



18-Sep-2008 



Orderable Device 


Status 


Pacltage 
Type 


Package 
Drawing 


Pins Package Eco Plan 
Qty 


Lead/Ball Finisli 


IVISL Peak Temp 


(RoHS) 


SN74LS688N3 


OBSOLETE 


PDIP 


N 


20 




TBD 


Call Tl 


Call Tl 


SN74LS688NE4 


ACTIVE 


PDIF 


N 


20 


20 


Pb-Free 
(RoHS) 


CU NIPDAU 


N / A for Pkg Type 


SN74LS688NSR 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sh/Rrl 


CU NIPDAU 


Level-1-260C-UNLIM 


SN74LS688NSRE4 


ACTIVE 


SO 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1 -260C-UNLIM 


SN74LS688NSRG4 


ACTIVE 


so 


NS 


20 


2000 


Green (RoHS & 
no Sb/Br) 


CU NIPDAU 


Level-1-260C-UNLIM 


SNJ54LS682FK 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


SNJ54LS682FK 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


SNJ54LS682J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SNJ54LS682J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SNJ54LS682W 


ACTIVE 


CFP 


W 


20 




TBD 


Call Tl 


N / A for Pkg Type 


SNJ54LS682W 


ACTIVE 


CFP 


W 


20 




TBD 


Call Tl 


N / A for Pkg Type 


SNJ54LS684FK 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


SNJ54LS684J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SNJ54LS684W 


ACTIVE 


CFP 


W 


20 




TBD 


Call Tl 


N / A for Pkg Type 


SNJ54LS688FK 


ACTIVE 


LCCC 


FK 


20 




TBD 


POST- PLATE 


N / A for Pkg Type 


SNJ54LS688J 


ACTIVE 


CDIP 


J 


20 




TBD 


A42 SNPB 


N / A for Pkg Type 


SNJ54LS688W 


ACTIVE 


CFP 


W 


20 




TBD 


Call Tl 


N / A for Pkg Type 



The marketing status values are defined as follows: 
ACTIVE: Product device recommended for new designs. 

LIFEBUY: Tl has announced that the device will be discontinued, and a lifetime-buy period is in effect. 

NRND: Not recommended for new designs. Device is in production to support existing customers, but Tl does not recommend using this part in 
a new design. 

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. 
OBSOLETE: Tl has discontinued the production of the device. 



please check 



Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) 
http://www.ti.com/productcontent for the latest availability information and additional product content details. 
TBD: The Pb-Free/Green conversion plan has not been defined. 

Pb-Free (RoHS): Tl's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements 
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered 
at high temperatures, Tl Pb-Free products are suitable for use in specified lead-free processes. 

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and 
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS 
compatible) as defined above. 

Green (RoHS & no Sb/Br): Tl defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame 
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) 



MSL, Peak Temp, 
temperature. 



The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder 



Important Information and Disclaimer:The information provided on this page represents Tl's knowledge and belief as of the date that it is 
provided. Tl bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the 
accuracy of such information. Efforts are underway to better integrate information from third parties. Tl has taken and continues to take 
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on 
incoming materials and chemicals. Tl and Tl suppliers consider certain information to be proprietary, and thus CAS numbers and other limited 
information may not be available for release. 



Addendum-Page 3 



^ ^^^^ PACKAGE OPTION ADDENDUM 

Instruments 

www.ti.com 18-Sep-2008 

In no event shall Tl's liability arising out of such information exceed the total purchase price of the Tl part(s) at issue in this document sold by Tl 
to Customer on an annual basis. 



Addendum-Page 4 



Texas 



Instruments 

www.ti.com 



PACKAGE MATERIALS INFORMATION 



5-Aug-2008 



TAPE AND REEL INFORMATION 

REEL DIMENSIONS 



Reel 
Diameter 




TAPE DIMENSIONS 

■KO H-P1- 



^ <!> <S> 



Cavity ^ 



<5> <|> <!> <|> 



AO 



T 

BO 



w 



AO 


Dimension designed to accommodate the component width 


BO 


Dimension designed to accommodate the component length 


KO 


Dimension designed to accommodate the component thickness 


W 


Overall width of the carrier tape 


P1 


Pitch between successive cavity centers 



Reel Width (W1) 

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE 



/ooooooooo 



Q1 1 Q2 




Q1 1 Q2 






Q3 1 Q4 




Q3 1 Q4 






1 




i 


i. 1 






1 







Sprocket Holes 



User Direction of Feed 



Pocket Quadrants 



*AII dimensions are nominal 



Device 


Package 
Type 


Package 
Drawing 


Pins 


SPQ 


Reel 
Diameter 
(mm) 


Reel 
Width 
W1 (mm) 


AO (mm) 


BO (mm) 


KO (mm) 


P1 

(mm) 


W 
(mm) 


Pini 
Quadrant 


SN74LS682DWR 


SOIC 


DW 


20 


2000 


330.0 


24.4 


10.8 


13.0 


2.7 


12.0 


24.0 


01 


SN74LS682NSR 


so 


NS 


20 


2000 


330.0 


24.4 


8.2 


13.0 


2.5 


12.0 


24.0 


01 


SN74LS684DWR 


SOIC 


DW 


20 


2000 


330.0 


24.4 


10.8 


13.0 


2.7 


12.0 


24.0 


01 


SN74LS684NSR 


so 


NS 


20 


2000 


330.0 


24.4 


8.2 


13.0 


2.5 


12.0 


24.0 


01 


SN74LS688DWR 


SOIC 


DW 


20 


2000 


330.0 


24.4 


10.8 


13.0 


2.7 


12.0 


24.0 


01 


SN74LS688NSR 


so 


NS 


20 


2000 


330.0 


24.4 


8.2 


13.0 


2.5 


12.0 


24.0 


01 



Pack Materials-Page 1 



PACKAGE MATERIALS INFORMATION 

5-Aug-2008 




*AII dimensions are nominal 



Device 


Package Type 


Package Drawing 


Pins 


SPQ 


Lengtli (mm) 


Widtli (mm) 


Height (mm) 


SN74LS682DWR 


SOIC 


DW 


20 


2000 


346.0 


346.0 


41.0 


SN74LS682NSR 


so 


NS 


20 


2000 


346.0 


346.0 


41.0 


SN74LS684DWR 


SOIC 


DW 


20 


2000 


346.0 


346.0 


41.0 


SN74LS684NSR 


so 


NS 


20 


2000 


346.0 


346.0 


41.0 


SN74LS688DWR 


SOIC 


DW 


20 


2000 


346.0 


346.0 


41.0 


SN74LS688NSR 


so 


NS 


20 


2000 


346.0 


346.0 


41.0 



Texas 
Instruments 

www.ti.com 



Pack Materials-Page 2 



J (R-GDIP-T**) 

14 LEADS SHOWN 



CERAMIC DUAL IN-LINE PACKAGE 



I B 1 



j u u u u u 

0.065 (1,65) 



0.045 (1,14) 



niiiii 
UIM 


14 


16 


18 


20 





0.300 
(7,62) 
BSC 


0.300 
(7,62) 
BSC 


0.300 
(7,62) 
BSC 


0.300 
(7,62) 
BSC 


B MAX 


0.785 
(19,94) 


.840 
(21,34) 


0.960 
(24,38) 


1.060 
(26,92) 


B MIN 










C MAX 


0.300 
(7,62) 


0.300 
(7,62) 


0.310 
(7,87) 


0.300 
(7,62) 


C MIN 


0.245 
(6,22) 


0.245 
(6,22) 


0.220 
(5,59) 


0.245 
(6,22) 



0.005 (0,13) MIN 



I 0.026 (0,66) 
'^0.014 (0,36) 



1 0.100 (2,54) 



0.060 (1,52) 
0.015 (0,38) 



f 

0.200 (5,08) MAX 
^ Seating Plane 



0.130 (3,30) MIN 



0.014 (0,36) 
0.008 (0,20) 




0-1 5* 



4040083/F 03/03 

NOTES: A. All linear dimensions are in inches (millimeters). 

B. This drawing is subject to change without notice. 

C. This package is hermetically sealed with a ceramic lid using glass frit. 

D. Index point is provided on cap for terminal identification only on press ceramic glass frit seal only. 

E. Falls within MIL STD 1835 GDIP1-T14, GDIP1-T16, GDIP1-T18 and GDIP1-T20. 



MECHANICAL DATA 



MLCC006B- OCTOBER 1996 



FK (S-CQCC-N**) 

28 TERMINAL SHOWN 



LEADLESS CERAMIC CHIP CARRIER 



ASQ 



18 17 16 15 14 13 12 




26 27 28 1 2 3 4 



NO. OF 
TERMINALS 

** 


A 


B 


MIN 


MAX 


MIN 


MAX 


20 


0.342 
(8,69) 


0.358 
(9,09) 


0.307 
(7,80) 


0.358 
(9,09) 


28 


0.442 
(11,23) 


0.458 
(11,63) 


0.406 
(10,31) 


0.458 
(11,63) 


44 


0.640 
(16,26) 


0.660 
(16,76) 


0.495 
(12,58) 


0.560 
(14,22) 


52 


0.739 

(18,78) 


0.761 
(19,32) 


0.495 

(12,58) 


0.560 

(14,22) 


68 


0.938 
(23,83) 


0.962 
(24,43) 


0.850 
(21,6) 


0.858 
(21,8) 


84 


1.141 

(28,99) 


1.165 
(29,59) 


1.047 
(26,6) 


1.063 

(27,0) 



0.020 (0,51) _^ u 
"1^ 




0.028(0,71) J L_ 
0.022(0,54) ~^ ^ 







4 ► 




0.050(1,27) 



0.035 (0,89) 



0.080 (2,03) 
0.064(1,63) 



40401 40 /D 10/96 



NOTES: A. All linear dimensions are in inches (millimeters). 

B. This drawing is subject to change without notice. 

C. This package can be hermetically sealed with a metal lid. 

D. The terminals are gold plated. 

E. Falls within JEDEC MS-004 



^ Texas 
Instruments 

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 



MECHANICAL DATA 



NS (R-PDSO-G**) 

14-PINS SHOWN 



PLASTIC SMALL-OUTLINE PACKAGE 



.27 



14 



o 



2,00 MAX 



0,51 
0,35 



1-^10.25®! 



0,15 NOM 



5,60 8,20 

5,00 7,40 




0-1 0" 




^\PINS « 
DIM 


14 


16 


20 


24 


A MAX 


10,50 


10,50 


12,90 


15,30 


A MIN 


9,90 


9,90 


12,30 


14,70 



4040062/C 03/03 

NOTES; A. All linear dimensions are in millimeters. 

B. This drawing is subject to change without notice. 

C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15. 



^ Texas 
instoume^ 

www.ti.com 



MECHANICAL DATA 



MPDI004 - OCTOBER 1 994 



NT (R-PDIP-T**) 
24 PINS SHOWN 



PLASTIC DUAL-IN-LINE PACKAGE 



24 13 



12 

— 0.070(1,78) MAX 



0.020 (0,51) MIN -| 



0.280 (7,11) 
0.250 (6,35) 



^\PINS ** 


24 


28 


A MAX 


1.260 
(32,04) 


1.425 
(36,20) 


A MIN 


1.230 
(31,24) 


1.385 
(35,18) 


B MAX 


0.310 
(7,87) 


0.315 
(8,00) 


B MIN 


0.290 

(7,37) 


0.295 
(7,49) 



0.200 (5,08) MAX 

4 Seating Plane 



^ 0.125(3, 



18) MIN 









0.100 (2,54) 


4 — ► 





0.021 (0,53) 
0.015(0,38) 



-0- 0.010(0,25) (M) 



0.010(0,25) NOM 




4040050 /B 04/95 



NOTES: A. All linear dimensions are in inches (millimeters). 

B. This drawing is subject to change without notice. 



Texas 
Instruments 

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 



MECHANICAL DATA 



W (R-GDFP-F20) 



CERAMIC DUAL FLATPACK 



0.045 (1,14) 



0.026 (0,66) 



0.100 (2,45) 
0.045 (1,14) 



0.540 (13,72) MAX 



0.370 (9,40) 
0.250 (6,35) 



< 0.320 (8,13) MAX ► 

1 20 
"C? 



0.300 (7,62) 
0.245 (6,22) 



Base and Seating Plane 



0.009 (0 
0.004 (0,10) 



I 

T 



0.022 (0,56) 
0.015 (0,38) 



0.050 (1,27) 



0.005 (0,13) MIN 
4 Places 



1 



11 



0.370 (9,40) 

0.250 (6,35) ^ 



4040180-4/D 07/03 

NOTES: A. All linear dimensions are In Inches (millimeters). 

B. This drawing Is subject to change without notice. 

C. This package can be hermetically sealed with a ceramic lid using glass frit. 

D. Index point is provided on cap for terminal Identification only. 

E. Falls within Mil-Std 1835 GDFP2-F20 



Texas 
Instruments 

www.ti.com 



MECHANICAL DATA 



DW (R-PDS0-G24) PLASTIC SMALL-OUTLINE PACKAGE 



0.614 (15,60) 
0.598 (15,20) 



24 13 




0.050 (1,27) 

0.016 (0,40)^^ ^ 

4040000-5/F 06/2004 



NOTES: A. All linear dimensions are in inches (millimeters). 

B. This drawing is subject to change without notice. 

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). 

D. Foils within JEDEC MS-013 variation AD. 



^ Texas 
Instruments 

www.ti.com 



MECHANICAL DATA 



DW (R-PDSO-G20) PLASTIC SMALL-OUTLINE PACKAGE 



0.512 (13,00) 

' 0.496 (12,60) 

20 11 



fl 




4040000-4/F 06/2004 



NOTES: A. All linear dimensions are in inches (millimeters). 

B. This drawing is subject to change without notice. 

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). 

D. Foils within JEDEC MS-013 variation AC. 



^ Texas 
Instruments 

www.ti.com 



MECHANICAL DATA 



N (R-PDIP-T**) 



PLASTIC DUAL-IN-LINE PACKAGE 



16 PINS SHOWN 



16 



9 



kp kp kp kp kp kJ 



0.260 (6,60) 
0.240 (6,10) 



A 



DIM 


14 


16 


18 


20 


A MAX 


0.775 
(19,69) 


0.775 
(19,69) 


0.920 
(23,37) 


1.060 
(26,92) 


A MIN 


0.745 
(18,92) 


0.745 
(18,92) 


0.850 
(21,59) 


0.940 
(23,88) 


MS-001 
VARIATION 


AA 


BB 


AC 


AD 



0.070 (1,78) 
0.045 (1,14) 



A 




4040049/E 12/2002 

NOTES: A. All linear dimensions are in inches (millimeters). 

B. This drawing is subject to change without notice. 

/&\ Falls within JEDEC MS-001, except 18 and 20 pin minimum body length (Dim A). 

/6\ The 20 pin end lead shoulder width is a vendor option, either half or full width. 



Texas 
Instruments 

www.ti.com 



IMPORTANT NOTICE 



Texas Instruments Incorporated and its subsidiaries (Tl) reserve the right to make corrections, modifications, enhancements, improvements, 
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should 
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are 
sold subject to Tl's terms and conditions of sale supplied at the time of order acknowledgment. 

Tl warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with Tl's standard 
warranty. Testing and other quality control techniques are used to the extent Tl deems necessary to support this warranty. Except where 
mandated by government requirements, testing of all parameters of each product is not necessarily performed. 

Tl assumes no liability for applications assistance or customer product design. Customers are responsible for their products and 
applications using Tl components. To minimize the risks associated with customer products and applications, customers should provide 
adequate design and operating safeguards. 

Tl does not warrant or represent that any license, either express or implied, is granted under any Tl patent right, copyright, mask work right, 
or other Tl intellectual property right relating to any combination, machine, or process in which Tl products or services are used. Information 
published by Tl regarding third-party products or services does not constitute a license from Tl to use such products or services or a 
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual 
property of the third party, or a license from Tl under the patents or other intellectual property of Tl. 

Reproduction of Tl information in Tl data books or data sheets is permissible only if reproduction is without alteration and is accompanied 
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive 
business practice. Tl is not responsible or liable for such altered documentation. Information of third parties may be subject to additional 
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Resale of Tl products or services with statements different from or beyond the parameters stated by Tl for that product or service voids all 
express and any implied warranties for the associated Tl product or service and is an unfair and deceptive business practice. Tl is not 
responsible or liable for any such statements. 

Tl products are not authorized for use in safety-critical applications (such as life support) where a failure of the Tl product would reasonably 
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing 
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and 
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products 
and any use of Tl products in such safety-critical applications, notwithstanding any applications-related information or support that may be 
provided by Tl. Further, Buyers must fully indemnify Tl and its representatives against any damages arising out of the use of Tl products in 
such safety-critical applications. 

Tl products are neither designed nor intended for use in military/aerospace applications or environments unless the Tl products are 
specifically designated by Tl as military-grade or "enhanced plastic." Only products designated by Tl as military-grade meet military 
specifications. Buyers acknowledge and agree that any such use of Tl products which Tl has not designated as military-grade is solely at 
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. 

Tl products are neither designed nor intended for use in automotive applications or environments unless the specific Tl products are 
designated by Tl as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated 
products in automotive applications, Tl will not be responsible for any failure to meet such requirements. 

Following are URLs where you can obtain information on other Texas Instruments products and application solutions: 



Products 

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amplifier.ti.com 

dataconverter.ti.com 

dsp.ti.com 

www.ti.com/clocks 

interface.ti.com 

loaic.ti.com 

power.ti.com 

microcontroller.ti.com 

www.ti-rfid.com 



RF/IF and ZigBee® Solutions www.ti.com/lprf 



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www.ti.com/audio 

www.ti.com/automotive 

www.ti.com/broadband 

www.ti.com/diaitalcontrol 

www.ti.com/medical 

www.ti.com/militarv 

www.ti.com/opticalnetwork 

www.ti.com/securitv 

www.ti.com/telephonv 

www.ti.com/video 

www.ti.com/wireless 



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